Plasma Cleaning by Application
Find the plasma cleaning approach proven for your process step.
Wire Bonding
Contaminated pads cause NSOP and low pull-strength wire bonds. Vacuum plasma cleaning restores bondability before bonding, not after the bonder is blamed.
Molding
Delamination under the mold compound usually traces back to the lead frame surface. Vacuum plasma cleaning restores adhesion before the press, not after.
Underfill
Voiding under underfill epoxy usually traces back to a die surface the epoxy never wetted. Vacuum plasma cleaning restores wettability before dispense.
Die Attach
Inconsistent die-attach pull strength is rarely the epoxy — it's lot-to-lot frame contamination. Vacuum plasma cleaning removes the variability before bonding.
Conformal Coating
Flux residue and low surface energy cause conformal coating to bead or pinhole. Vacuum plasma cleaning restores wettability before the board reaches coating.
Plasma Desmear
Resin smear left by via drilling blocks reliable copper plating inside the hole. Plasma desmear clears it before plating, without touching the copper.
Adhesive Bonding
Adhesive bonds fail on low-energy or contaminated surfaces, not bad epoxy. Plasma cleaning activates the surface so the bond forms the way it was qualified to.
Surface Activation
Paint, photoresist and thin films that won't wet evenly usually trace back to substrate surface energy. Plasma activation fixes that before the next step.
Photoresist & Ashing
Residual photoresist left after etch or implant contaminates every step downstream. Oxygen plasma ashing clears it completely without damaging the substrate.