SCI Mini
Compact Benchtop Plasma Cleaner
SCI Mini Benchtop Plasma Cleaner Applications
SCI Mini is a compact, benchtop batch plasma cleaning system that brings low-pressure plasma processing within reach of universities, R&D groups and budget-conscious laboratories.
It runs on the same control platform as our production systems: a Windows 11 LTSC PC with fieldbus and the SCI plasma software, with multi-step recipes, automatic process logging and user access levels. Built around a robust 40 kHz plasma source, it delivers consistent, repeatable surface treatment without the cost or complexity of a high-power production system.
SCI Mini is typically used for:
- Surface activation before bonding, coating or printing
- Removal of organic contamination
- Improving adhesion and wettability of surfaces
- Plasma cleaning of PCBs and electronic assemblies
- Surface preparation before gluing or potting
- Plasma etching of organic layers
- Teaching and research in plasma surface science
Process gases include pure Ar, He, O2, N2 and H2, and N2/H2, Ar/O2 and Ar/H2 mixtures. Fluorinated gases (CF4, SF6) and others are available on request.
Its simple operation and small footprint make SCI Mini ideal for teaching, research and process feasibility studies across the Semiconductor, Electronics and Automotive sectors, and a practical first step before moving up to a higher-throughput system such as AEON.
SCI Mini Batch Plasma System Specifications
Machine Type
Compact Benchtop Batch Plasma System
Footprint
550W x 600L x 725H mm
Weight 150 kg
Plasma chamber configuration
1 powered shelf with planar electrode (RIE)
Nickel-coated aluminium chamber Ø280 x 300L mm (18.5 L)
Max product size
230W x 254L x 100H mm
Min product size
N/A
Plasma generator
200W generator at 40 kHz
Gas lines
2 Process gas lines
Max flow rate 200 mL/min
Pumping system
Two-stage oil vacuum pump 140 L/min
Capacitive gauge 0.0001 to 1 mbar
Controller
Win11 LTSC PC with fieldbus 10" Touchscreen
Proprietary SCI software
Facilities
Single phase 110-240V 50/60 Hz 2.5KVA
Process gas pressure 1 to 1.5 bar
Process gas purity 99.995% or better
Swagelok 6 mm OD gas fittings
Exhaust port 25 mm OD
Certifications
CE S2 S8 Cleanroom ISO7 (10k)
Options
Hydrogen generator (up to 500 mL/min)
250 L/min dry vacuum pump
300W RF Generator 13.56 MHz
Up to 4 mass flow controlled gas lines
Cleanroom ISO5 (100) compatible
Stainless steel AISI 304 plasma chamber
Compare SCI Systems
SCI Mini
Category
Batch
Batch
Batch
Machine Type
Compact Benchtop Batch Plasma System
Table-Top Batch Plasma System
Standalone batch plasma cleaner for bulky products or plasma desmearing system
Footprint
550W x 600L x 725H mm
Weight 150 kg
670W x 948L x 812H mm
1503W x 1820L x 2101H mm
Plasma Chamber Configuration
1 powered shelf with planar electrode (RIE)
Nickel-coated aluminium chamber Ø280 x 300L mm (18.5 L)
4 shelves with 4 couples of powered electrode and ground electrode
4 shelves with 4 couples of powered electrode and ground electrode
OR
4 holders for PCB desmearing
Max product size
230W x 254L x 100H mm
350W x 325L x 217H mm
500W X 520L X 625H mm
Min product size
N/A
N/A
N/A
Plasma generator
200W generator at 40 kHz
300W RF Generator 13.56 MHz
Automatic tuning system
600W RF Generator 13.56 MHz
Automatic tuning system or
5kW generator at 40 kHz
Gas lines
2 Process gas lines
Max flow rate 200 mL/min
2 Process gas lines with Mass Flow Controller
2 Process gas lines with Mass Flow Controller
1 Purge line
Pumping system
Two-stage oil vacuum pump 140 L/min
Capacitive gauge 0.0001 to 1 mbar
Dry vacuum pump 250 L/min
Dry vacuum pump 1670 L/min or
Dry vacuum pump 1830 L/min plus booster pump at 8400 L/min
Controller
Win11 LTSC PC with fieldbus 10" Touchscreen
Proprietary SCI software
Win11 LTSC PC with fieldbus 16" Touchscreen
Proprietary SCI software
Win11 LTSC PC with fieldbus 21" Touchscreen
Proprietary SCI software
Facilities
Single phase 110-240V 50/60 Hz 2.5KVA
Process gas pressure 1 to 1.5 bar
Process gas purity 99.995% or better
Swagelok 6 mm OD gas fittings
Exhaust port 25 mm OD
Single phase 110-240V 50/60 Hz, 2.5KVA
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 25 mm OD
Single phase 110-240V 50/60 Hz
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 40 mm OD
Certifications
CE S2 S8 Cleanroom ISO7 (10k)
CE S2 S8 Cleanroom ISO7 (10k)
CE S2 S8 Cleanroom ISO7 (10k)
Options
Hydrogen generator (up to 500 mL/min)
250 L/min dry vacuum pump
300W RF Generator 13.56 MHz
Up to 4 mass flow controlled gas lines
Cleanroom ISO5 (100) compatible
Stainless steel AISI 304 plasma chamber
Purge line
600 W RF Generator
600 L/min dry vacuum pump (external)
Kit for using pure hydrogen and hydrogen generator
Dry vacuum pump 5000 L/min
Kit for using pure hydrogen and hydrogen generator

